Job Duties
- 28nm and beyond logic technology process integration, documentation, PCM and test vehicle tape-out related coordination. Characterization of logic core/IO devices, layout dependence effect, derivative, and SRAM devices. Design rule and LOP documentation, command files with CAD team.
- Collaborate with technology partners and customers to develop company’s technology strategy and roadmap, including identifying new markets and opportunities for growth.
- Managing the budget for the technology development department, including overseeing the purchase and maintenance of equipment, and ensuring that resources are allocated effectively.
- Ensuring that the company’s technology development efforts are aligned with its intellectual property strategy, including managing patents and other forms of intellectual property.
- Leading and mentoring the team of engineers and researchers responsible for technology development, including hiring and training new staff as needed.
Education
- Master’s or PhD degree in Electrical Engineering, Electronics, Physics, Materials Science, or related field.
Experience
- Experience: 20+ years of semiconductor process integration and development experience in 12-inch wafer fabs, with at least 8 years of integration management and 28nm experience.
- Experience in at least three of the following units: Integration/Device/Module/Design Support/Litho.
Requirements
- Has a successful record of leading 40nm/28nm technology development to mass production.
- Integration responsibility for at least three of the following units: FEOL/MEOL/BEOL/Defect (YE)/Specialty.
